Heraeus Electronics, a leading provider of materials solutions for the semiconductor and electronic packaging industries, has announced a strategic partnership with Toshiba Materials.
Under the terms of the partnership, the companies will jointly develop and produce metal ceramic substrates made of silicon nitride (Si3N4), for use in high-performance electronics.
The growth of the e-mobility market in particular has created increased demand for more efficient, economical and reliable power electronic components for hybrid and electric vehicles.
Toshiba Materials will provide the metal ceramic substrates, which Heraeus Electronics will structure and finalize according to customer specifications. Toshiba Materials will continue to supply finalized substrates in established markets. Both companies will gain from the collaboration, combining their expertise in ceramic substrate production; technology for the bonding of metal and ceramics; structuring; finalizing; and sales, enabling them to better supply the market.
“The European market wants a highly reliable and highly functional ceramic substrate, and we are convinced that silicon nitride will be a solution for it,” said Takao Shirai, director of Toshiba Materials.
“Because Europe is environmentally conscious with a significant industrial base of automobiles and power modules, we believe it is a huge potential market for silicon nitride metal ceramic substrates with high reliability.”
The collaboration with Toshiba Materials will enable Heraeus Electronics to expand its Condura metal ceramic substrates portfolio and to push its Condura.Prime offering.
“This way, we can launch new solutions much more quickly, be more agile, and respond more rapidly to trends,” said Dr Klemens Brunner, president of Heraeus Electronics.
作者：TARA CRAIG
